The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2011
Filed:
Apr. 23, 2008
Wen-tsung Tseng, Taichung, TW;
Ho-yi Tsai, Taichung Hsien, TW;
Chien-ping Huang, Taichung, TW;
Cheng-hsu Hsiao, Nantou, TW;
Wen-Tsung Tseng, Taichung, TW;
Ho-Yi Tsai, Taichung Hsien, TW;
Chien-Ping Huang, Taichung, TW;
Cheng-Hsu Hsiao, Nantou, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A heat-dissipating semiconductor package structure and a method for manufacturing the same is disclosed. The method includes: disposing on and electrically connecting to a chip carrier at least a semiconductor chip and a package unit; disposing on the top surface of the package unit a heat-dissipating element having a flat portion and a supporting portion via the flat portion; receiving the package unit and semiconductor chip in a receiving space formed by the flat portion and supporting portion of the heat-dissipating element; and forming on the chip carrier encapsulant for encapsulating the package unit, semiconductor chip, and heat-dissipating element. The heat-dissipating element dissipates heat generated by the package unit, provides EMI shielding, prevents delamination between the package unit and the encapsulant, decreases thermal resistance, and prevents cracking.