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For the Inventor, By the Inventor

Taichung, Taiwan

Ho-Yi Tsai

This inventor holds 26 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2003-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ho-Yi Tsai. Retrieved from https://idiyas.com/inventor/ho-yi-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 

% Patents Active = 73.1

Average Co-Inventor Count = 3.2

ph-index = 8

Forward Citations = 484(Granted Patents)


Location History:

  • Chiayi, TW (2003 - 2005)
  • Tantzu, TW (2006)
  • Taichung, JP (2011)
  • Taichung Hsien, TW (2007 - 2014)
  • Taichung, TW (2005 - 2020)

Company Filing History:

goldMedal26 out of 826 
 
Siliconware Precision Industries Co., Ltd.
 patents

Years Active: 2003-2020

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Areas of Expertise:
Semiconductor Package
Substrate Structure
Heat Dissipation
Electronic Carrier Board
Stack Structure
Fabrication Method
Thermal Management
Reinforced Under-Support
EMI Shielding
Surface Mount Technology
Bump Structure
Multi-Media Card
26 patents (USPTO):Explore Patents
1. 10679932 - Semiconductor package and a substrate for packaging (2020-06-09),
2. 9666453 - Semiconductor package and a substrate for packaging (2017-05-30),
3. 9368467 - Substrate structure and semiconductor package using the same (2016-06-14),
4. 9013042 - Interconnection structure for semiconductor package (2015-04-21),
5. 8895366 - Fabrication method of semiconductor package (2014-11-25),
6. 8698326 - Semiconductor package and fabrication method thereof (2014-04-15),
7. 8420521 - Method for fabricating stack structure of semiconductor packages (2013-04-16),
8. 8361843 - Method for fabricating heat dissipation package structure (2013-01-29),
9. 8013443 - Electronic carrier board and package structure thereof (2011-09-06),
10. 8008769 - Heat-dissipating semiconductor package structure and method for manufacturing the same (2011-08-30),
11. 7889511 - Electronic carrier board applicable to surface mount technology (2011-02-15),
12. 7855443 - Stack structure of semiconductor packages and method for fabricating the stack structure (2010-12-21),
13. 7696623 - Electronic carrier board and package structure thereof (2010-04-13),
14. 7608915 - Heat dissipation semiconductor package (2009-10-27),
15. 7573722 - Electronic carrier board applicable to surface mounted technology (SMT) (2009-08-11),

Title: Innovations of Ho-Yi Tsai in Semiconductor Packaging

Introduction: Ho-Yi Tsai is a prominent inventor based in Taichung, Taiwan, holding an impressive portfolio of 26 patents. His work has significantly impacted the field of semiconductor packaging, addressing critical challenges in the industry.

Latest Patents: Two of Ho-Yi Tsai's latest patents focus on advancements in semiconductor packaging. The first patent presents a semiconductor package that comprises a substrate with a metal pattern layer, a semiconductor die placed on the substrate, and an underfill material situated between the substrate and the semiconductor die. Notably, the innovation includes an opening in the metal pattern layer that minimizes the area of contact between the underfill and the metal pattern layer, effectively eliminating underfill delamination. This thoughtful design enhances the reliability and performance of semiconductor devices.

Career Highlights: Ho-Yi Tsai is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in semiconductor packaging solutions. His contributions to the field are recognized not only through his patents but also through his commitment to advancing technology in semiconductor manufacturing processes.

Collaborations: Throughout his career, Ho-Yi Tsai has collaborated with several esteemed colleagues, including Chien-Ping Huang and Cheng-Hsu Hsiao. These partnership efforts have fostered innovation and pushed the boundaries of what is achievable in semiconductor packaging technology.

Conclusion: Ho-Yi Tsai's contributions to the semiconductor industry, particularly through his recent patents and collaborations, underscore his role as a key inventor in this field. His work not only helps to solve existing challenges but also paves the way for future advancements in semiconductor packaging.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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