The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2016
Filed:
Oct. 18, 2012
Applicant:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Inventors:
Assignee:
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H01L 24/16 (2013.01); H01L 23/49816 (2013.01); H05K 1/111 (2013.01); H01L 24/13 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81385 (2013.01); H01L 2924/00014 (2013.01); H05K 3/3436 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/10674 (2013.01); Y02P 70/611 (2015.11);
Abstract
A substrate structure is provided, including a substrate body and a plurality of circuits formed on the substrate body. At least one of the circuits has an electrical contact for connecting to an external element and the electrical contact is narrower in width than the circuit, thereby meeting the requirements of fine line/fine pitch and miniaturization, improving the product yield and reducing the fabrication cost.