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Taichung, Taiwan

Chin-Tsai Yao

This inventor holds 15 USPTO granted patents and 6 published patent applications. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2014-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chin-Tsai Yao. Retrieved from https://idiyas.com/inventor/chin-tsai-yao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 15 

% Patents Active = 100.0

Average Co-Inventor Count = 3.6

ph-index = 4

Forward Citations = 36(Granted Patents)


Location History:

  • Taichung Hsien, TW (2015)
  • Taichung, TW (2014 - 2024)

Company Filing History:

goldMedal15 out of 826 
 
Siliconware Precision Industries Co., Ltd.
 patents

Years Active: 2014-2024

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15 patents (USPTO):Explore Patents
1. 11973014 - Method of manufacturing substrate structure with filling material formed in concave portion (2024-04-30),
2. 10679932 - Semiconductor package and a substrate for packaging (2020-06-09),
3. 10522453 - Substrate structure with filling material formed in concave portion (2019-12-31),
4. 10510720 - Electronic package and method for fabricating the same (2019-12-17),
5. 9900996 - Package substrate and structure (2018-02-20),
6. 9842771 - Semiconductor device and fabrication method thereof and semiconductor structure (2017-12-12),
7. 9666453 - Semiconductor package and a substrate for packaging (2017-05-30),
8. 9607963 - Semiconductor device and fabrication method thereof (2017-03-28),
9. 9520351 - Packaging substrate and package structure (2016-12-13),
10. 9425152 - Method for fabricating EMI shielding package structure (2016-08-23),
11. 9368467 - Substrate structure and semiconductor package using the same (2016-06-14),
12. 9190387 - Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding function (2015-11-17),
13. 9013042 - Interconnection structure for semiconductor package (2015-04-21),
14. 8963298 - EMI shielding package structure and method for fabricating the same (2015-02-24),
15. 8736030 - Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same (2014-05-27),

Title: Chin-Tsai Yao: Pioneering Inventor from Taichung

Introduction: Chin-Tsai Yao is a distinguished inventor hailing from Taichung, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chin-Tsai Yao holds several patents in the areas of electronics, renewable energy, and sustainable technologies, showcasing his commitment to creating solutions for a better future.

Career Highlights: With a career spanning over two decades, Chin-Tsai Yao has worked with leading tech companies and research institutions, where he has spearheaded projects that have revolutionized the industry.

Collaborations: Throughout his career, Chin-Tsai Yao has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge-sharing.

Conclusion: Chin-Tsai Yao's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor, inspiring the next generation of innovators to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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