The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2011
Filed:
Aug. 04, 2009
Fang-lin Tsai, Taichung, TW;
Ho-yi Tsai, Taichung, TW;
Wen-tsung Tseng, Taichung, TW;
Chih-ming Huang, Taichung, TW;
Fang-Lin Tsai, Taichung, TW;
Ho-Yi Tsai, Taichung, TW;
Wen-Tsung Tseng, Taichung, TW;
Chih-Ming Huang, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
An electronic carrier board is provided, including a carrier, at least two paired bond pads formed on the carrier, and a protective layer covering the carrier. The protective layer is formed with openings corresponding in position to the two bond pads. The openings are aligned in the same direction and expose at least a first sidewall and a second sidewall of each of the two bond pads. The first sidewall is perpendicular to an alignment direction of the bond pads and the second sidewall is parallel to the alignment direction of the bond pads. A distance between the first sidewall of at least one of the bond pads and a corresponding side of a corresponding one of the openings is at least about 50 μm greater than a distance between the second sidewall of the at least one bond pad and a corresponding side of the corresponding opening.