= 16.60 Inventors with similar research interests:
Location History:
- Hsintsu Hsien, TW (2002)
- Taiwan, TW (2002)
- Chutung Chen Hsien, TW (2002 - 2003)
- Chudon, TW (2003)
- Chudon Town, TW (2004)
- Hsichu, TW (2003 - 2005)
- Taichung Hsien, TW (2005 - 2009)
- Hsinchu, TW (2001 - 2010)
- Hsinchu Hsein, TW (2006 - 2010)
- Hsin chu Hsien, TW (2001 - 2011)
- Tantzu, TW (2006 - 2012)
- Taichung, TW (2001 - 2022)
Years Active: 2001-2022
Title: Chien-Ping Huang: Innovator in Semiconductor Packaging
Introduction:
Chien-Ping Huang, a renowned inventor based in Taichung, Taiwan, has made substantial contributions in the field of semiconductor packaging. With an impressive portfolio of 192 patents, his innovative approaches have revolutionized the industry. This article delves into Huang's latest patents, career highlights, and notable collaborations, highlighting his significant impact on the field of semiconductor technology.
Latest Patents:
One of Huang's recent patents is the "Method for fabricating carrier-free semiconductor package." This invention presents a process that involves half-etching a metal carrier to create recess grooves and metal studs, which serve as solder or die pads. The recess grooves are filled with a first encapsulant, enhancing adhesion to the metal carrier and eliminating the conventional issues of weak and pliable copper plates. This method also reduces fabrication costs and improves electrical connection quality by enabling flexible placement of conductive traces.
Another notable patent is the "Carrier-free semiconductor package and fabrication method." This innovation showcases a similar process to the previous patent, focusing on the elimination of costly metals as an etching resist layer. By halving the metal carrier to form recess grooves and metal studs, this method provides a solution for transportation difficulties. The first encapsulant applied to fill the recess grooves enhances adhesion, ultimately improving the overall functionality and durability of the semiconductor package.
Career Highlights:
Throughout his career, Chien-Ping Huang has displayed exceptional expertise and dedication to the field of semiconductor packaging. His numerous patents contribute to improving fabrication techniques, reducing costs, and enhancing the quality of electrical connections in semiconductor packages. Huang's ingenuity and problem-solving skills have played a crucial role in addressing industry challenges and advancing the development of semiconductor technology.
Collaborations:
Chien-Ping Huang has collaborated with several prominent individuals in the field of semiconductor packaging. Notably, he has worked at Siliconware Precision Industries Co., Ltd. and Silicon Precision Industries Co., Ltd., where he has further honed his skills and encountered other talented professionals. Among his coworkers, Cheng-Hsu Hsiao and Chun-Chi Ke have notably contributed to the collaboration and success of various inventions.
Conclusion:
Chien-Ping Huang's exceptional contributions to the field of semiconductor packaging highlight his innovative mindset and dedication to technological advancements. Through his patents, Huang has introduced novel methods for fabricating carrier-free semiconductor packages, addressing key industry challenges and improving overall performance. His collaborations with esteemed colleagues have further enhanced the impact of his work. As the semiconductor industry continues to evolve, Huang's innovative solutions will undoubtedly continue to shape its future.
Inventor’s Patent Attorneys refers to legal professionals with specialized expertise in representing inventors throughout the patent process. These attorneys assist inventors in navigating the complexities of patent law, including filing patent applications, conducting patent searches, and protecting intellectual property rights. They play a crucial role in helping inventors secure patents for their innovative creations.