The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2014
Filed:
Apr. 13, 2010
Pang-chun Lin, Taichung, TW;
Hsiao-jen Hung, Taichung, TW;
Chun-yuan LI, Taichung, TW;
Chien-ping Huang, Taichung, TW;
Chun-chi KE, Taichung Hsien, TW;
Pang-Chun Lin, Taichung, TW;
Hsiao-Jen Hung, Taichung, TW;
Chun-Yuan Li, Taichung, TW;
Chien-Ping Huang, Taichung, TW;
Chun-Chi Ke, Taichung Hsien, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A package structure includes a base body having a first encapsulant and a wiring layer embedded in and exposed from the first encapsulant. The wiring layer has a plurality of conductive traces and a plurality of first electrical contact pads. The first encapsulant has openings for exposing the first electrical contact pads, a chip electrically connected to the wiring layer, and a second encapsulant formed on the base body for covering the chip and the wiring layer, thereby providing an even surface for preventing the encapsulant from cracking when the chip is mounted.