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Taichung, Taiwan

Chun-Chi Ke

USPTO Granted Patents = 41 (Patent Applications = 7)

Average Co-Inventor Count = 3.4

ph-index = 8

Forward Citations = 258(Granted Patents)

Location History:

Taichung Hsien, TW (2008 - 2014)
Taichung, TW (2001 - 2022)

Company Filing History:

Siliconware Precision Industries Co., Ltd.

Years Active: 2001-2022

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Areas of Expertise:

Semiconductor Package

EMI Shielding

Chip Scale Package

MEMS Element

Fabrication Method

Micro-Electromechanical Element

Electrical Connecting Structures

Carrier-Free Package

Quad Flat Non-Leaded Package

Conductive Bumps

Encapsulated Electronic Package

Supporting Plate

41 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11289409 - Method for fabricating carrier-free semiconductor package (2022-03-29),

2. 11195812 - Method for fabricating an encapsulated electronic package using a supporting plate (2021-12-07),

3. 10833394 - Electronic package and method for fabricating the same (2020-11-10),

4. 10566271 - Carrier-free semiconductor package and fabrication method (2020-02-18),

5. 10192834 - Semiconductor package and fabrication method thereof (2019-01-29),

6. 10074613 - Method of fabricating semiconductor package including cutting encapsulating body and carrier to form packages (2018-09-11),

7. 9673151 - Semiconductor package having metal layer (2017-06-06),

8. 9425152 - Method for fabricating EMI shielding package structure (2016-08-23),

9. 9254994 - Package structure having MEMS element (2016-02-09),

10. 9190387 - Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding function (2015-11-17),

11. 9190296 - Fabrication method of semiconductor package without chip carrier (2015-11-17),

12. 9177837 - Fabrication method of semiconductor package having electrical connecting structures (2015-11-03),

13. 9040361 - Chip scale package with electronic component received in encapsulant, and fabrication method thereof (2015-05-26),

14. 8981575 - Semiconductor package structure (2015-03-17),

15. 8975734 - Semiconductor package without chip carrier and fabrication method thereof (2015-03-10),

Title: The Innovative Journey of Inventor Chun-Chi Ke

Introduction: Chun-Chi Ke, a talented inventor hailing from Taichung, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Chun-Chi Ke's latest patents focus on renewable energy solutions, including a solar panel design that maximizes energy efficiency and a wind turbine technology that enhances power generation in urban environments.

Career Highlights: With a career spanning over two decades, Chun-Chi Ke has established himself as a pioneer in sustainable technology. His work has been recognized globally, earning him prestigious awards for his innovative approach to environmental challenges.

Collaborations: Throughout his career, Chun-Chi Ke has collaborated with leading research institutions and universities to further advance his inventions. His partnerships have led to the development of cutting-edge technologies that have the potential to revolutionize the renewable energy sector.

Conclusion: Chun-Chi Ke's passion for innovation and commitment to creating a more sustainable future have solidified his reputation as a visionary inventor. His relentless pursuit of technological advancements continues to inspire the next generation of inventors worldwide.

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