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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10833394 B1

PDFFull Text
Date of Patent:
Nov. 10, 2020

Filed:

Aug. 07, 2019

Electronic package and method for fabricating the same

Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Wen-Jung Tsai, Taichung, TW;

Mao-Hua Yeh, Taichung, TW;

Chih-Hsien Chiu, Taichung, TW;

Ying-Chou Tsai, Taichung, TW;

Chun-Chi Ke, Taichung, TW;

Assignee:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Attorneys:

Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.

Peter F. Corless

Steven M. Jensen

Primary Examiner:

Thuy Vinh Tran

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01Q 1/22 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01Q 1/36 (2006.01); H01Q 1/38 (2006.01); H01Q 1/40 (2006.01); H01Q 9/04 (2006.01); H01L 23/538 (2006.01); H01L 21/77 (2017.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01Q 1/36 (2013.01); H01L 21/56 (2013.01); H01L 21/77 (2013.01); H01L 23/5389 (2013.01); H01L 24/11 (2013.01); H01L 24/27 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6688 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06586 (2013.01); H01Q 1/38 (2013.01); H01Q 1/40 (2013.01); H01Q 9/0407 (2013.01);
Abstract

An electronic package and a method for fabricating the same are provided. An antenna frame, a first electronic component, and a second electronic component electrically connected to the antenna frame are disposed on a lower side of a carrying structure. An antenna structure is disposed on an upper side of the carrying structure and is electrically connected to the first electronic component. Therefore, two different types of antennas are integrated into an identical electronic package. Such the electronic package bonded to a circuit can transmit signals with two different wavelengths, even if the electronic package does not have any area increased.

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