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For the Inventor, By the Inventor

Taichung, Taiwan

Ying-Chou Tsai

This inventor holds 23 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Packaging. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2002-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ying-Chou Tsai. Retrieved from https://idiyas.com/inventor/ying-chou-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 95.7

Average Co-Inventor Count = 3.0

ph-index = 7

Forward Citations = 197(Granted Patents)


Location History:

  • Hsinchu, TW (2002 - 2004)
  • Taichung, TW (2004 - 2022)

Company Filing History:

goldMedal23 out of 826 
 
Siliconware Precision Industries Co., Ltd.
 patents

Years Active: 2002-2022

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Areas of Expertise:
Semiconductor Package
Fabrication Method
Electronic Package
Flip-Chip Structure
Packaging Substrate
Circuit Structure
Underfilling Process
Ball-Grid-Array
Encapsulate Sensing Chip
Package Structure
Wire-Bonded Chip
Process Fabrication
23 patents (USPTO):Explore Patents
1. 11404361 - Method for fabricating package structure having encapsulate sensing chip (2022-08-02),
2. 11114393 - Electronic package and method for fabricating the same (2021-09-07),
3. 10872847 - Package structure and method for fabricating the same (2020-12-22),
4. 10833394 - Electronic package and method for fabricating the same (2020-11-10),
5. 10224243 - Method of fabricating electronic package (2019-03-05),
6. 10201090 - Fabrication method of circuit structure (2019-02-05),
7. 9991197 - Fabrication method of semiconductor package (2018-06-05),
8. 9978673 - Package structure and method for fabricating the same (2018-05-22),
9. 9899235 - Fabrication method of packaging substrate (2018-02-20),
10. 9805979 - Electronic package and fabrication method thereof (2017-10-31),
11. 9699910 - Circuit structure and fabrication method thereof (2017-07-04),
12. 9362217 - Package on package structure and fabrication method thereof (2016-06-07),
13. 9265154 - Packaging substrate and fabrication method thereof (2016-02-16),
14. 9165789 - Fabrication method of packaging substrate (2015-10-20),
15. 9006039 - Fabrication method of packaging substrate, and fabrication method of semiconductor package (2015-04-14),

Title: Inventor Ying-Chou Tsai

Introduction: Ying-Chou Tsai is a renowned inventor hailing from Taichung, Taiwan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Tsai's latest patents include innovative designs in the fields of renewable energy, sustainable materials, and advanced electronics.

Career Highlights: Throughout his career, Tsai has been recognized for his exceptional problem-solving skills and ability to translate complex ideas into practical inventions. He has received numerous awards for his work in improving efficiency and sustainability in various industries.

Collaborations: Tsai has collaborated with leading research institutions and universities to further develop his inventions and bring them to market. His partnerships have led to the successful commercialization of several cutting-edge technologies.

Conclusion: Ying-Chou Tsai's dedication to innovation and his passion for creating solutions to real-world challenges have solidified his reputation as a pioneering inventor in the global technology landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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