The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 22, 2020
Filed:
Sep. 29, 2017
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Shao-Tzu Tang, Taichung, TW;
Jia-Fong Yeh, Taiwan, TW;
Yi-Hsuan Liu, Taichung, TW;
Mei-Chi Chen, Taichung, TW;
Ying-Chou Tsai, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A package structure and a method for fabricating the same are provided. An electronic component such as a sensing chip and a conductive element such as a bonding wire are mounted to a carrier, encapsulated by an encapsulant, and electrically connected through a conductive layer. As such, the electronic component can further be electrically connected to the carrier through the conductive layer and the conductive element. Therefore, the sensing chip can be packaged through current packaging processes, thereby reducing the fabrication cost, shortening the fabrication time and improving the product yield.