Taiwan, Taiwan

Jia-Fong Yeh


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Taiwan, TW (2018 - 2020)
  • Taichung, TW (2022)

Company Filing History:


Years Active: 2018-2022

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3 patents (USPTO):Explore Patents

Title: Innovations by Jia-Fong Yeh

Introduction

Jia-Fong Yeh is a notable inventor based in Taiwan, recognized for his contributions to the field of electronic packaging. With a total of 3 patents, he has made significant advancements that enhance the efficiency and cost-effectiveness of electronic components.

Latest Patents

One of his latest patents is titled "Method for fabricating package structure having encapsulate sensing chip." This patent describes a package structure and a method for fabricating it, where an electronic component, such as a sensing chip, and a conductive element, like a bonding wire, are mounted to a carrier. These components are encapsulated by an encapsulant and electrically connected through a conductive layer. This innovative approach allows the sensing chip to be packaged using current packaging processes, which reduces fabrication costs, shortens fabrication time, and improves product yield.

Another significant patent by Jia-Fong Yeh is "Package structure and method for fabricating the same." Similar to his previous work, this patent outlines a method where an electronic component and a conductive element are mounted to a carrier, encapsulated, and connected through a conductive layer. This method also aims to enhance the efficiency of the packaging process, leading to better yield and reduced costs.

Career Highlights

Jia-Fong Yeh is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to innovate in the field of electronic packaging. His work has been instrumental in advancing the technology used in electronic components, making them more efficient and reliable.

Collaborations

Throughout his career, Jia-Fong Yeh has collaborated with talented individuals such as Shao-Tzu Tang and Ying-Chou Tsai. These collaborations have contributed to the development of innovative solutions in electronic packaging.

Conclusion

Jia-Fong Yeh's contributions to the field of electronic packaging through his patents and collaborations highlight his role as a significant inventor in Taiwan. His work not only improves the efficiency of electronic components but also sets a foundation for future innovations in the industry.

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