The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 22, 2018

Filed:

Jan. 04, 2017
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Shao-Tzu Tang, Taiwan, TW;

Jia-Fong Yeh, Taiwan, TW;

Chien-Hui Wang, Taiwan, TW;

Chung-Yan Huang, Taiwan, TW;

Ying-Chou Tsai, Taichung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/60 (2006.01); H01L 23/00 (2006.01); G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 23/49805 (2013.01); H01L 23/562 (2013.01); H01L 23/60 (2013.01); G06K 9/0002 (2013.01); G06K 9/00053 (2013.01);
Abstract

A package structure is provided, including a carrier, an electronic component disposed on the carrier and having a sensing area, an encapsulant formed on the carrier and encapsulating the electronic component and the sensing area, and a conductive layer formed on the encapsulant with the sensing area of the electronic component free from being covered by the conductive layer. The encapsulant prevents a user's finger from being in direct contact with the sensing area so as to protect the sensing area from being damaged and hence ensure normal operation of the electronic component.


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