Tainan, Taiwan

Chien-Hui Wang

This inventor holds 1 USPTO granted patent. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chien-Hui Wang. Retrieved from https://idiyas.com/inventor/chien-hui-wang-tnu6l92a

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Chien-Hui Wang: Innovator in Electronic Packaging Technology

Introduction

Chien-Hui Wang is a notable inventor based in Taiwan, recognized for his contributions to electronic packaging technology. With a focus on enhancing the functionality and durability of electronic components, Wang has made significant strides in the field.

Latest Patents

Wang holds a patent for a "Package structure and method for fabricating the same." This innovative package structure includes a carrier with an electronic component that has a sensing area. The design features an encapsulant that protects the electronic component and the sensing area from direct contact, ensuring the component's normal operation. This encapsulation prevents damage to the sensing area, which is crucial for maintaining the integrity of the electronic device.

Career Highlights

Chien-Hui Wang is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His work has contributed to advancements in the reliability and performance of electronic devices.

Collaborations

Wang collaborates with talented colleagues such as Shao-Tzu Tang and Jia-Fong Yeh, who share his commitment to innovation in electronic packaging.

Conclusion

Chien-Hui Wang's contributions to electronic packaging technology exemplify the importance of innovation in enhancing the functionality and durability of electronic components. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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