Taiwan, Taiwan

Chung-Yan Huang


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Innovations by Chung-Yan Huang

Introduction

Chung-Yan Huang is a notable inventor based in Taiwan, recognized for his contributions to electronic packaging technology. His innovative approach has led to the development of a unique package structure that enhances the functionality and durability of electronic components.

Latest Patents

Huang holds a patent for a "Package structure and method for fabricating the same." This invention includes a carrier with an electronic component that has a sensing area. The encapsulant formed on the carrier encapsulates the electronic component and the sensing area, while a conductive layer is formed on the encapsulant, ensuring that the sensing area remains uncovered. This design prevents direct contact from a user's finger, protecting the sensing area from damage and ensuring the normal operation of the electronic component. He has 1 patent to his name.

Career Highlights

Chung-Yan Huang is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor packaging industry. His work focuses on advancing packaging technologies that improve the performance and reliability of electronic devices.

Collaborations

Huang collaborates with talented colleagues, including Shao-Tzu Tang and Jia-Fong Yeh, who contribute to the innovative environment at Siliconware Precision Industries Co., Ltd.

Conclusion

Chung-Yan Huang's inventive spirit and dedication to improving electronic packaging have made a significant impact in the field. His patent showcases his commitment to innovation and the advancement of technology in the electronics industry.

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