The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2019

Filed:

Sep. 14, 2017
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Shao-Tzu Tang, Taichung, TW;

Chang-Yi Lan, Taichung, TW;

Ying-Chou Tsai, Taichung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/3157 (2013.01); H01L 24/92 (2013.01); H01L 24/94 (2013.01); H01L 24/96 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 22/12 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/1148 (2013.01); H01L 2224/1191 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/92 (2013.01); H01L 2224/94 (2013.01); H01L 2224/96 (2013.01); H01L 2924/00015 (2013.01); H01L 2924/1816 (2013.01); H01L 2924/3512 (2013.01); H01L 2924/35121 (2013.01); H01L 2924/37001 (2013.01);
Abstract

An electronic package is provided, which includes: an electronic element having an active surface with a plurality of electrode pads, an inactive surface opposite to the active surface, and a side surface adjacent to and connecting the active and inactive surfaces; a plurality of conductive elements formed on the electrode pads of the electronic element; and an encapsulant covering the active and side surfaces of the electronic element and portions of side surfaces of the conductive elements and exposing the inactive surface of the electronic element. Therefore, the invention enhances the structural strength of the active surface of the electronic element so as to prevent cracking of the electronic element and hence avoid delamination of the conductive elements from the electronic element.


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