Chang-Yi Lan

Title: Chang-Yi Lan: Innovator in Electronic Packaging

Introduction

Chang-Yi Lan is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 3 patents. His innovative approaches have enhanced the structural integrity and functionality of electronic components.

Latest Patents

One of his latest patents is titled "Method of Fabricating Electronic Package." This invention provides an electronic package that includes an electronic element with an active surface featuring multiple electrode pads. The design enhances the structural strength of the active surface, preventing cracking and delamination of conductive elements. Another notable patent is "Package on Package Structure and Fabrication Method Thereof." This method outlines a process for creating a package on package (PoP) structure, which effectively separates support portions to prevent bridging, thereby improving the reliability of electronic assemblies.

Career Highlights

Chang-Yi Lan is currently employed at Siliconware Precision Industries Co., Ltd. His work at this leading company in the semiconductor industry has allowed him to focus on innovative packaging solutions that meet the demands of modern electronics.

Collaborations

He has collaborated with notable coworkers, including Shao-Tzu Tang and Ying-Chou Tsai, contributing to advancements in electronic packaging technologies.

Conclusion

Chang-Yi Lan's contributions to electronic packaging through his patents and collaborative efforts have significantly impacted the industry. His innovative methods continue to enhance the performance and reliability of electronic devices.