The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
May. 02, 2017
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Chih-Hsien Chiu, Taichung, TW;
Hao-Ju Fang, Taichung, TW;
Hsin-Lung Chung, Taichung, TW;
Cho-Hsin Chang, Taichung, TW;
Tsung-Hsien Tsai, Taichung, TW;
Chia-Yang Chen, Taichung, TW;
Chun-Chi Ke, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A semiconductor package is provided, including: a substrate having opposing first and second surfaces; a plurality of semiconductor components disposed on and electrically connected to the first surface; an encapsulant encapsulating the first surface and the semiconductor components and having at least one first groove that partitions the substrate into a plurality of package units, each of which has at least one of the semiconductor components; and a metal layer formed on the substrate and the encapsulant and encapsulating a periphery of the package units, with the second surface exposed from the metal layer, wherein the metal layer is formed along a wall surface of the first groove, to form a second groove corresponding in position to the first groove and having a metal surface. Therefore, the package units are isolated and form a multilayer isolated structure, including metal layers and air layers, and are electromagnetically shielded from one another.