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Taichung, Taiwan

Chun-Yuan Li

This inventor holds 14 USPTO granted patents. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2006-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chun-Yuan Li. Retrieved from https://idiyas.com/inventor/chun-yuan-li

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14

% Patents Active = 85.7

Average Co-Inventor Count = 4.6

ph-index = 3

Forward Citations = 206(Granted Patents)


Location History:

  • Taichung Hsien, TW (2007 - 2008)
  • Taichung, TW (2006 - 2016)

Company Filing History:

goldMedal14 out of 826 
 
Siliconware Precision Industries Co., Ltd.
 patents

Years Active: 2006-2016

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14 patents (USPTO):Explore Patents
1. 9362217 - Package on package structure and fabrication method thereof (2016-06-07),
2. 9177837 - Fabrication method of semiconductor package having electrical connecting structures (2015-11-03),
3. 9130064 - Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier (2015-09-08),
4. 8981575 - Semiconductor package structure (2015-03-17),
5. 8873244 - Package structure (2014-10-28),
6. 8716861 - Semiconductor package having electrical connecting structures and fabrication method thereof (2014-05-06),
7. 8618641 - Leadframe-based semiconductor package (2013-12-31),
8. 8421199 - Semiconductor package structure (2013-04-16),
9. 8390118 - Semiconductor package having electrical connecting structures and fabrication method thereof (2013-03-05),
10. 8304268 - Fabrication method of semiconductor package structure (2012-11-06),
11. 7934313 - Package structure fabrication method (2011-05-03),
12. 7314820 - Carrier-free semiconductor package and fabrication method thereof (2008-01-01),
13. 7230323 - Ground-enhanced semiconductor package and lead frame for the same (2007-06-12),
14. 7126229 - Wire-bonding method and semiconductor package using the same (2006-10-24),

Title: Chun-Yuan Li: Pioneering Inventor from Taichung

Introduction: Chun-Yuan Li is a distinguished inventor hailing from Taichung, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chun-Yuan Li holds several patents in the areas of electronics, renewable energy, and sustainable technologies, showcasing his commitment to creating solutions for a better future.

Career Highlights: With a career spanning over two decades, Chun-Yuan Li has worked with leading tech companies, research institutions, and universities, where he has spearheaded numerous projects that have pushed the boundaries of innovation.

Collaborations: Throughout his career, Chun-Yuan Li has collaborated with top engineers, scientists, and researchers from around the globe, fostering a culture of creativity and excellence in all his endeavors.

Conclusion: Chun-Yuan Li's passion for innovation, coupled with his relentless drive to solve complex challenges, has solidified his reputation as a visionary inventor in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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