The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 03, 2011
Filed:
Apr. 13, 2010
Pang-chun Lin, Taichung, TW;
Hsiao-jen Hung, Taichung, TW;
Chun-yuan LI, Taichung, TW;
Chien-ping Huang, Taichung, TW;
Chun-chi KE, Taichung Hsien, TW;
Pang-Chun Lin, Taichung, TW;
Hsiao-Jen Hung, Taichung, TW;
Chun-Yuan Li, Taichung, TW;
Chien-Ping Huang, Taichung, TW;
Chun-Chi Ke, Taichung Hsien, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A fabrication method of a package structure includes: preparing a metal plate having first and second surfaces and defined with an active region; forming a wiring layer with conductive traces and first electrical contact pads on the first surface; forming third electrical contact pads corresponding to the first electrical contact pads on the second surface; forming a first encapsulant on the first surface; forming on the second surface an open area to penetrate the metal plate, wherein the metal plate form conductive posts between the first and third electrical contact pads; mounting in the open area a chip electrically connected to the wiring layer; forming a second encapsulant in the open area, the wiring layer and the third electrical contact pads; forming first and second openings in the first and second encapsulants to expose the third electrical contact pads, respectively; and cutting the metal plate to remove the metal layer.