Hsiao-Jen Hung

Title: Hsiao-Jen Hung: Innovator in Package Structure Technology

Introduction

Hsiao-Jen Hung is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of package structure technology, holding two patents that showcase his innovative approach to electronic packaging.

Latest Patents

His latest patents include a novel package structure and a fabrication method for that structure. The package structure features a base body with a first encapsulant and a wiring layer that is embedded and exposed. This design incorporates a plurality of conductive traces and first electrical contact pads, with openings in the encapsulant to expose these pads. Additionally, a chip is electrically connected to the wiring layer, and a second encapsulant covers both the chip and wiring layer, ensuring a smooth surface to prevent cracking during chip mounting. The fabrication method outlines a detailed process for creating this package structure, including the preparation of a metal plate, formation of wiring layers, and encapsulants, as well as the mounting of the chip.

Career Highlights

Hsiao-Jen Hung is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to develop innovative packaging solutions. His work has been instrumental in advancing the technology used in electronic devices.

Collaborations

He collaborates with talented coworkers, including Pang-Chun Lin and Chun-Yuan Li, who contribute to the innovative projects at their company.

Conclusion

Hsiao-Jen Hung's contributions to package structure technology reflect his dedication to innovation in the electronics field. His patents demonstrate a commitment to improving the reliability and efficiency of electronic packaging solutions.