The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2007
Filed:
Aug. 05, 2003
Yi-shiung Lee, Taichung Hsien, TW;
Chun-yuan LI, Taichung Hsien, TW;
Holman Chen, Taichung Hsien, TW;
Shih-tsun Huang, Taichung Hsien, TW;
Chih-yung Yun, Taichung Hsien, TW;
Yi-Shiung Lee, Taichung Hsien, TW;
Chun-Yuan Li, Taichung Hsien, TW;
Holman Chen, Taichung Hsien, TW;
Shih-Tsun Huang, Taichung Hsien, TW;
Chih-Yung Yun, Taichung Hsien, TW;
Abstract
A ground-enhanced semiconductor package and a lead frame used in the package are provided. The semiconductor package includes a lead frame having a die pad, a plurality of tie bars connected with and supporting the die pad, a plurality of leads surrounding the die pad, and a ground structure, wherein the ground structure comprises at least one of first ground portions connected to the tie bars, and/or at least one of second ground portions connected to the die pad, and wherein the first ground portions are separate from each other, and the second ground portions are separate from each other; at least one chip mounted on the die pad and electrically connected to the leads and the ground structure; and an encapsulation body for encapsulating the chip and the lead frame. The separately-arranged ground portions allow thermal stresses to be released from the ground structure without rendering deformation issues.