Location History:
- Taichung, TW (2004 - 2006)
- Taichung Hsien, TW (2007)
Company Filing History:
Years Active: 2004-2007
Title: Holman Chen: Innovator in Semiconductor Packaging
Introduction
Holman Chen is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His innovative designs focus on enhancing the performance and reliability of semiconductor devices.
Latest Patents
Among his latest patents is the "Ground-enhanced semiconductor package and lead frame for the same." This invention features a lead frame with a die pad, tie bars, and a ground structure that allows for effective thermal stress management. The design ensures that the ground portions are separately arranged, preventing deformation issues during operation. Another notable patent is the "Wire-bonding method and semiconductor package using the same." This method introduces a unique arrangement of wires that prevents short circuits during the encapsulation process, enhancing the overall reliability of the semiconductor package.
Career Highlights
Holman Chen is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His work has been instrumental in advancing packaging technologies that are crucial for modern electronic devices.
Collaborations
Throughout his career, Holman has collaborated with talented individuals such as Chin-Teng Hsu and Chun-Yuan Li. These partnerships have fostered innovation and contributed to the successful development of his patented technologies.
Conclusion
Holman Chen's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of the challenges in semiconductor design and offer practical solutions that enhance device performance.