The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2008
Filed:
Jan. 24, 2005
Yu-wei Lin, Taichung Hsien, TW;
Fu-di Tang, Taichung Hsien, TW;
Chun-yuan LI, Taichung Hsien, TW;
Terry Tsai, Taichung Hsien, TW;
Yu-ting Ho, Taichung Hsien, TW;
Yu-Wei Lin, Taichung Hsien, TW;
Fu-Di Tang, Taichung Hsien, TW;
Chun-Yuan Li, Taichung Hsien, TW;
Terry Tsai, Taichung Hsien, TW;
Yu-Ting Ho, Taichung Hsien, TW;
Abstract
A carrier-free semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of: providing a carrier having a plurality of electrical contacts formed thereon; mounting at least one chip on the carrier; electrically connecting the chip to the electrical contacts via a plurality of bonding wires; forming a coating layer on each of the electrical contacts to encapsulate a bonded end of each of the bonding wires on the electrical contacts; performing a molding process to form an encapsulant for encapsulating the chip, the bonding wires and the electrical contacts; and removing the carrier, such that bottom surfaces of the electrical contacts are exposed from the encapsulant. This obtains a semiconductor package not having a carrier, and the coating layers can enhance adhesion between the electrical contacts and the encapsulant.