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For the Inventor, By the Inventor

Taichung, Taiwan

Fu-Di Tang

USPTO Granted Patents = 17 

Average Co-Inventor Count = 3.3

ph-index = 5

Forward Citations = 194(Granted Patents)


Location History:

  • Taichung Hsien, TW (2008)
  • Taichung, TW (2002 - 2022)

Company Filing History:

goldMedal17 out of 818 
 
Siliconware Precision Industries Co., Ltd.
 patents

Years Active: 2002-2022

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17 patents (USPTO):Explore Patents
1. 11289409 - Method for fabricating carrier-free semiconductor package (2022-03-29),
2. 10566271 - Carrier-free semiconductor package and fabrication method (2020-02-18),
3. 9190296 - Fabrication method of semiconductor package without chip carrier (2015-11-17),
4. 9177837 - Fabrication method of semiconductor package having electrical connecting structures (2015-11-03),
5. 8975734 - Semiconductor package without chip carrier and fabrication method thereof (2015-03-10),
6. 8835225 - Method for fabricating quad flat non-leaded semiconductor package (2014-09-16),
7. 8716861 - Semiconductor package having electrical connecting structures and fabrication method thereof (2014-05-06),
8. 8624368 - Quad flat non-leaded semiconductor package (2014-01-07),
9. 8390118 - Semiconductor package having electrical connecting structures and fabrication method thereof (2013-03-05),
10. 8241967 - Semiconductor package with a support structure and fabrication method thereof (2012-08-14),
11. 7893547 - Semiconductor package with a support structure and fabrication method thereof (2011-02-22),
12. 7679172 - Semiconductor package without chip carrier and fabrication method thereof (2010-03-16),
13. 7314820 - Carrier-free semiconductor package and fabrication method thereof (2008-01-01),
14. 7126229 - Wire-bonding method and semiconductor package using the same (2006-10-24),
15. 6696752 - Encapsulated semiconductor device with flash-proof structure (2004-02-24),

Title: Fu-Di Tang: Innovator in Semiconductor Packaging

Introduction

Fu-Di Tang is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 17 patents. His innovative approaches have led to advancements that enhance the quality and efficiency of semiconductor manufacturing.

Latest Patents

One of Fu-Di Tang's latest patents is a method for fabricating a carrier-free semiconductor package. This method involves half-etching a metal carrier to create multiple recess grooves and metal studs, which serve as solder pads or die pads. The process includes filling the recess grooves with a first encapsulant and forming an antioxidant layer on the metal studs. This invention addresses the common issue of weak and pliable copper plates, improving adhesion and reducing transportation difficulties. Additionally, it eliminates the need for costly metals as an etching resist layer, thereby lowering fabrication costs and allowing for flexible conductive trace placement on the metal carrier.

Career Highlights

Fu-Di Tang is associated with Siliconware Precision Industries Co., Ltd., where he has been instrumental in developing innovative semiconductor packaging solutions. His work has not only advanced the technology but has also contributed to the company's reputation as a leader in the semiconductor industry.

Collaborations

Fu-Di Tang has collaborated with notable coworkers, including Chien-Ping Huang and Chun-Chi Ke. Their combined expertise has fostered a collaborative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Fu-Di Tang's contributions to semiconductor packaging through his inventive methods and collaborative efforts have significantly impacted the industry. His work continues to pave the way for advancements in semiconductor technology, showcasing the importance of innovation in this field.

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