The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2012
Filed:
Feb. 22, 2011
Chien-ping Huang, Taichung, TW;
Fu-di Tang, Taichung, TW;
Chien-Ping Huang, Taichung, TW;
Fu-Di Tang, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A semiconductor package with a support structure and a fabrication method thereof are provided. With a chip being electrically connected to electrical contacts formed on a carrier, a molding process is performed. A plurality of recessed portions formed on the carrier are filled with an encapsulant for encapsulating the chip during the molding process. After the carrier is removed, the part of the encapsulant filling the recessed portions forms outwardly protruded portions on a surface of the encapsulant, such that the semiconductor package can be attached to an external device via the protruded portions.