Taichung, Taiwan

Yu-Ting Ho

This inventor holds 1 USPTO granted patent. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Ting Ho. Retrieved from https://idiyas.com/inventor/yu-ting-ho-bgsfe2f7

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 57(Granted Patents)


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Innovations by Yu-Ting Ho in Semiconductor Packaging

Introduction

Yu-Ting Ho is a notable inventor based in Taichung Hsien, Taiwan. He has made significant contributions to the field of semiconductor packaging, particularly with his innovative approaches to carrier-free designs. His work is characterized by a focus on enhancing the efficiency and reliability of semiconductor packages.

Latest Patents

Yu-Ting Ho holds a patent for a "Carrier-free semiconductor package and fabrication method thereof." This invention provides a novel fabrication method that includes several key steps. The process begins with providing a carrier that has multiple electrical contacts formed on it. At least one chip is then mounted on the carrier, and it is electrically connected to the contacts using bonding wires. A coating layer is formed on each electrical contact to encapsulate the bonded ends of the wires. Following this, a molding process is performed to create an encapsulant that protects the chip, bonding wires, and electrical contacts. Finally, the carrier is removed, exposing the bottom surfaces of the electrical contacts from the encapsulant. This innovative approach results in a semiconductor package that does not require a carrier, enhancing adhesion between the electrical contacts and the encapsulant.

Career Highlights

Yu-Ting Ho is currently employed at Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His work there has been instrumental in advancing semiconductor packaging technologies. He has demonstrated a commitment to innovation and excellence in his field.

Collaborations

Yu-Ting Ho collaborates with talented colleagues, including Yu-Wei Lin and Fu-Di Tang. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies in semiconductor packaging.

Conclusion

Yu-Ting Ho's contributions to the semiconductor industry, particularly through his carrier-free packaging innovations, highlight his role as a leading inventor. His work not only advances technology but also sets new standards in semiconductor manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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