The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2023
Filed:
Jan. 28, 2021
Applicant:
Winbond Electronics Corp., Taichung, TW;
Inventors:
Assignee:
WINBOND ELECTRONICS CORP., Taichung, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10805 (2013.01); H01L 27/1087 (2013.01); H01L 29/0653 (2013.01);
Abstract
A semiconductor memory structure includes a semiconductor substrate including an active region and a chop region. The semiconductor memory structure also includes an isolation structure disposed in the chop region, a first gate structure extending at least through the isolation structure in the chop region, and a second gate structure extending at least through the active region. The semiconductor memory structure also includes a doped region disposed in the active region. A first distance between the doped region and the first gate structure is shorter than a second distance between the doped region and the second gate structure.