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Taichung, Taiwan

Winbond Electronics Corporation

USPTO Granted Patents = 2,114

% Expired Patents = 6.0

EPO Patents = 45

Trademarks = 11

Forward Citations = 11,013

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1,244 inventors (with patents filed for the assignee):

Shi-Tron Lin (67 out of 68 patents)

Ta-Lee Yu (49 out of 78 patents)

Masaru Yano (45 out of 80 patents)

4. Frederick Chen (41 out of 67 patents)

5. Chi-Shun Lin (38 out of 39 patents)

6. Ping-Kun Wang (36 out of 36 patents)

7. Bo-Lun Wu (34 out of 35 patents)

8. Wen-Yueh Jang (33 out of 39 patents)

9. Wei-Fan Chen (32 out of 47 patents)

10. Rong-Fuh Shyu (32 out of 34 patents)

11. Bingxue Shi (32 out of 36 patents)

12. Po-Yen Hsu (31 out of 35 patents)

13. Hsiu-Han Liao (30 out of 30 patents)

14. Tzu-Ming Ou Yang (28 out of 28 patents)

15. Ming-Che Lin (24 out of 27 patents)

Core Competencies:

Semiconductor Structure

Memory Device

Flash Memory

Dynamic Random-Access Memory

Non-Volatile Memory

Resistive Memory

Testing Method

Voltage Generating Circuit

Error Correction Code

Isolation Structure

Chip-On-Board Module

Control Circuit

2,114 patents: Sort by Forward Citations

1. 12764949 - Semiconductor memory device and method for forming the same (2026-10-13),

2. 12764940 - Dynamic random access memory with buried bit line and method for forming the same (2026-10-13),

3. 12764937 - Method for forming semiconductor device (2026-10-13),

4. 12764929 - Memory device and method of forming the same (2026-10-13),

5. 12763144 - Word line decoder, control method of memory device and word line drive circuit (2026-10-13),

6. 12763125 - Row hammer refresh address calculation method and calculation circuit, and semiconductor memory device mounting the calculation circuit (2026-10-13),

7. 12757394 - Method of manufacturing memory device (2026-10-06),

8. 12754671 - Semiconductor device, storage system and operation method (2026-10-06),

9. 12751314 - Die package structure and method for forming the same (2026-09-29),

10. 12751005 - Memory device and method for forming the same (2026-09-29),

11. 12749522 - Semiconductor memory device and method for controlling the same for row-hammer refresh operations without reducing the performance of normal refresh operations (2026-09-29),

12. 12745446 - Semiconductor structure and method of forming the same (2026-09-22),

13. 12745399 - Method of forming memory structure (2026-09-22),

14. 12740045 - Semiconductor structure and manufacturing method thereof (2026-09-15),

15. 12738340 - Flash memory and testing method thereof (2026-09-15),

Company Overview

Winbond Electronics Corporation, headquartered in Taichung, Taiwan, specializes in semiconductor memory solutions. The company focuses on developing and manufacturing a range of memory products, including Flash Memory, Dynamic Random-Access Memory (DRAM), and Non-Volatile Memory. Winbond is recognized for its expertise in semiconductor structures and resistive memory technologies, as well as innovative testing methods and voltage generating circuits. Its commitment to advancing memory technology positions it as a key player in the semiconductor industry.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

2,114 Patents

#1 in Taichung

#14 in Taiwan

#477 in the World

Taichung, Taiwan

Winbond Electronics Corporation

Forward Citations = 11,013

1,244 inventors:

Shi-Tron Lin (67 out of 68 patents)

Ta-Lee Yu (49 out of 78 patents)

Masaru Yano (45 out of 80 patents)

4. Frederick Chen (41 out of 67 patents)

5. Chi-Shun Lin (38 out of 39 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Winbond Electronics Corporation. Retrieved from https://idiyas.com/company/winbond-electronics

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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