For the Inventor, By the Inventor

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Taichung, Taiwan

Winbond Electronics Corporation

USPTO Granted Patents = 2,103

% Expired Patents = 6.0

EPO Patents = 45

Trademarks = 11

Forward Citations = 11,013

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1,243 inventors (with patents filed for the assignee):

Shi-Tron Lin (67 out of 68 patents)

Ta-Lee Yu (49 out of 78 patents)

Masaru Yano (45 out of 80 patents)

4. Frederick Chen (40 out of 66 patents)

5. Chi-Shun Lin (38 out of 39 patents)

6. Ping-Kun Wang (36 out of 36 patents)

7. Bo-Lun Wu (34 out of 35 patents)

8. Wen-Yueh Jang (33 out of 39 patents)

9. Wei-Fan Chen (32 out of 47 patents)

10. Rong-Fuh Shyu (32 out of 34 patents)

11. Bingxue Shi (32 out of 36 patents)

12. Po-Yen Hsu (31 out of 35 patents)

13. Hsiu-Han Liao (30 out of 30 patents)

14. Tzu-Ming Ou Yang (27 out of 27 patents)

15. Ming-Che Lin (24 out of 27 patents)

Core Competencies:

Semiconductor Structure

Memory Device

Flash Memory

Dynamic Random-Access Memory

Non-Volatile Memory

Resistive Memory

Testing Method

Voltage Generating Circuit

Error Correction Code

Isolation Structure

Chip-On-Board Module

Control Circuit

2,103 patents: Sort by Forward Citations

1. 12745446 - Semiconductor structure and method of forming the same (2026-09-22),

2. 12745399 - Method of forming memory structure (2026-09-22),

3. 12740045 - Semiconductor structure and manufacturing method thereof (2026-09-15),

4. 12738340 - Flash memory and testing method thereof (2026-09-15),

5. 12730710 - Memory device and data erasing method thereof (2026-09-08),

6. 12730147 - Testing circuit for testing electrical devices and device under test (2026-09-08),

7. 12727143 - Three-dimensional dynamic random access memory (2026-09-01),

8. 12726197 - Voltage level shifter (2026-09-01),

9. 12725667 - Memory device and control method thereof (2026-09-01),

10. 12725648 - Memory apparatus, refresh control circuit and row hammer refresh method (2026-09-01),

11. 12713643 - SEMICONDUCTOR DEVICE WITH FLOATING MAIN BODY REGION VERTICALLY SEPARATING SOURCE FROM DRAIN AND METHOD FORMING THE SAME (2026-08-18),

12. 12713594 - SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (2026-08-18),

13. 12713578 - MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF (2026-08-18),

14. 12696441 - Semiconductor structure (2026-07-28),

15. 12696440 - Semiconductor structure and method of manufacturing the same (2026-07-28),

Winbond Electronics Corporation is a leading global supplier of semiconductor solutions. With headquarters in Taiwan, the company specializes in memory ICs and offers a wide range of products including DRAM, Flash, and IoT solutions. Winbond strives to provide innovative and reliable solutions to meet the needs of various industries, including automotive, consumer electronics, industrial, and more.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 22 2026

Winbond Electronics Corporation

2,103 Patents

#1 in Taichung

#14 in Taiwan

#478 in the World

Taichung, Taiwan

Winbond Electronics Corporation

Forward Citations = 11,013

1,243 inventors:

Shi-Tron Lin (67 out of 68 patents)

Ta-Lee Yu (49 out of 78 patents)

Masaru Yano (45 out of 80 patents)

4. Frederick Chen (40 out of 66 patents)

5. Chi-Shun Lin (38 out of 39 patents)

Please report any incorrect information to [email protected]

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