Taichung, Taiwan

Yi-Min Fu

USPTO Granted Patents = 9 

Average Co-Inventor Count = 4.5

ph-index = 1


Company Filing History:


Years Active: 2018-2025

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9 patents (USPTO):Explore Patents

Title: The Innovations of Yi-Min Fu

Introduction

Yi-Min Fu is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of nine patents. His work focuses on improving the reliability and efficiency of electronic components through innovative designs and manufacturing methods.

Latest Patents

Among his latest patents is an electronic package and manufacturing method that addresses the issue of stress concentration in substrate structures. This invention involves an electronic module and at least one support member placed on a substrate structure with a circuit layer. The design effectively disperses stress through the support member, preventing warping of the substrate structure. Another notable patent is an electronic package that features a circuit structure with auxiliary circuit layers. This design allows for an electronic component to be electrically connected to these auxiliary layers, enhancing the overall functionality of the package.

Career Highlights

Yi-Min Fu is currently employed at Siliconware Precision Industries Co., Ltd., where he continues to innovate in the field of electronic packaging. His expertise and dedication have led to advancements that benefit the industry and improve product performance.

Collaborations

He has collaborated with notable coworkers such as Chi-Ching Ho and Yu-Po Wang, contributing to various projects that leverage their combined expertise in electronics.

Conclusion

Yi-Min Fu's contributions to electronic packaging through his patents and collaborative efforts highlight his role as a key innovator in the industry. His work not only addresses current challenges but also paves the way for future advancements in technology.

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