The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2026

Filed:

Aug. 11, 2023
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung City, TW;

Inventors:

Chia-Chu Lai, Taichung City, TW;

Yi-Min Fu, Taichung City, TW;

Chien-Sheng Chen, Taichung City, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2023.01); H10W 44/20 (2026.01); H10W 74/01 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01); H10W 74/15 (2026.01);
U.S. Cl.
CPC ...
H10W 44/20 (2026.01); H10W 74/016 (2026.01); H10W 74/121 (2026.01); H10W 90/00 (2026.01); H10W 44/209 (2026.01); H10W 44/248 (2026.01); H10W 74/15 (2026.01); H10W 90/724 (2026.01); H10W 90/734 (2026.01);
Abstract

An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure with a circuit layer, a first encapsulating layer and a second encapsulating layer are formed on the carrier structure to cover the electronic element, a first antenna layer is formed on the first encapsulating layer, and a second antenna layer communicatively connected to the first antenna layer is formed on the second encapsulating layer. Therefore, the thickness of the first encapsulating layer is used to control the resonance distance of the antenna frequency so as to generate better resonance effect, and the distance between the first antenna layer and the second antenna layer is controlled by the thickness of the second encapsulating layer to increase the bandwidth of the antenna.


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