Siliconware Precision Industries Co., Ltd.

Wen-Jung Tsai

Chih-Hsien Chiu

Ko-Wei Chang

Chia-Yang Chen

Chien-Cheng Lin

Chia-Chu Lai

Ying-Chou Tsai

Shao-Tzu Tang

Yu-Wei Yeh

Siang-Yu Lin

Chia-Cheng Chen

Chun-Chi Ke

Tsung-Hsien Tsai

Fu-Tang Huang

Hsin-Lung Chung

Chi-Ching Ho

Mao-Hua Yeh

Chi-Liang Shih

Chih-Chiang He

Sheng-Ming Yang

Cheng Kai Chang

Jui-Feng Chen

Chia-Cheng Hsu

Chen-Wen Huang

Jia-Huei Hung

Ping-Hung Liao

Ching-Chia Chen

Shun-Yu Chien

Che-Wei Yu

Cheng-Piao Tung

Chin-Chiang He

An electronic package is provided, in which electronic elements and at least one packaging module including a semiconductor chip and a shielding structure covering the semiconductor chip are disposed on a carrier structure, an encapsulation layer encapsulates the electronic elements and the packaging module, and a shielding layer is formed on the encapsulation layer and in contact with the shielding structure. Therefore, the packaging module includes the semiconductor chip and the shielding structure and has a chip function and a shielding wall function simultaneously.

Electronic package and manufacturing method thereof

An electronic package is provided, in which an electronic element is disposed on a carrier structure, and an interposer is stacked on the electronic element. Further, a wire is connected to the interposer and grounds the carrier structure, such that the wire and the interposer surround the electronic element. Therefore, the wire can be used as a shielding element when the electronic package is in operation to prevent the electronic element from being subjected to external electromagnetic interference.

Electronic package including an interposer stacked on an electronic element and manufacturing method thereof

An electronic package is provided, in which a circuit structure is stacked on a carrier structure having a routing layer via support structures, where electronic elements are disposed on upper and lower sides of the circuit structure and the carrier structure, and the electronic elements and the support structures are encapsulated by a cladding layer, such that the electronic package can effectively increase the packaging density to meet the requirements of multi-functional end products.

Electronic package

An antenna module is provided with a plurality of antenna structures and a shielding structure arranged on a plate body, and the shielding structure is located between two adjacent antenna structures, where the shielding structure includes a concave portion formed on the plate body and a dielectric material formed between the concave portion and the antenna structure to generate different impedance characteristics, thereby improving the antenna isolation.

Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereof

An electronic package is provided and includes at least one electronic element, at least one first conductive structure and a second conductive structure disposed on one side of a carrier structure with at least one circuit layer, and an encapsulation layer covering the electronic element, the first conductive structure and the second conductive structure, where the first conductive structure is exposed from the encapsulation layer to externally connect required elements according to functional requirements.

An electronic package is formed by disposing an electronic element and a lead frame having a plurality of conductive posts on a carrier structure having an antenna function, and encapsulating the electronic element and the lead frame with an encapsulant. The encapsulant is defined with a first encapsulating portion and a second encapsulating portion lower than the first encapsulating portion. The electronic element is positioned in the first encapsulating portion, and the plurality of conductive posts are positioned in the second encapsulating portion. End surfaces of the plurality of conductive posts are exposed from a surface of the second encapsulating portion so as to be electrically connected to a connector.

Electronic package including lead frame having multiple conductive posts

Provided is an electronic package, in which a conductive structure and an encapsulation layer covering the conductive structure are arranged on one side of a carrier structure having a circuit layer, and an electronic component is arranged on the other side of the carrier structure. The rigidity of the carrier structure is increased by the encapsulation layer, and problems such as warpage or wavy deformations caused by increasing the volume of the electronic package due to functional requirements can be eliminated.

An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.

Electronic package and method for manufacturing the same

An electronic package and a manufacturing method of the electronic package are provided, in which an electronic component is arranged on a wiring structure and covered with a packaging layer, and a frame body that does not contact the wiring structure nor cover the electronic component is embedded in the packaging layer.

Multiple conductive posts

An electronic package is provided, including at least an electronic element and at least an antenna structure disposed on a carrier structure. The antenna structure includes a base portion configured with an antenna body and a plurality of support portions disposed on the base portion. As such, the base portion is disposed over the carrier structure through the support portions and a plurality of open areas are formed between the base portion and the carrier structure to serve as an air gap, thereby effectively improving the performance gain and efficiency of the antenna body.

Fabrication method of electronic package having antenna function

An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.

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Taichung, Taiwan

Wen-Jung Tsai