The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Sep. 14, 2022
Siliconware Precision Industries Co., Ltd., Taichung City, TW;
Hsin-Jou Lin, Taichung City, TW;
Lung-Yuan Wang, Taichung City, TW;
Feng Kao, Taichung City, TW;
Chiu-Ling Chen, Taichung City, TW;
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung City, TW;
Abstract
A method of manufacturing an electronic package is provided, in which a package module including a routing structure is stacked on a carrier structure via a plurality of conductive elements, a heat dissipation member covers a part of a surface of the routing structure, and an electronic module is disposed on another part of the surface of the routing structure, so that the routing structure is formed with at least one heat dissipation pad bonded to the heat dissipation member, such that the heat energy of the electronic module and the package module can be dissipated via the heat dissipation pad and the heat dissipation member.