Chiu-Ling Chen

Title: Innovations by Chiu-Ling Chen in Electronic Packaging

Introduction

Chiu-Ling Chen is a notable inventor based in Taichung City, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 2 patents. His work focuses on improving heat dissipation methods in electronic devices, which is crucial for enhancing their performance and longevity.

Latest Patents

Chiu-Ling Chen's latest patents include innovative designs for electronic packages. The first patent, titled "Electronic package with improved heat dissipating and manufacturing method thereof," describes an electronic package where an electronic element is placed on a carrier structure. A heat conduction layer is formed on the electronic element, and a heat dissipation member with a recess portion is positioned on the heat conduction layer. This design allows for better heat flow management, facilitating the formation of a robust intermetallic structure between the heat dissipation member and the electronic element, thereby enhancing the heat dissipation effect.

The second patent, "Electronic package and manufacturing method thereof," outlines a method for manufacturing an electronic package. In this method, a package module with a routing structure is stacked on a carrier structure using multiple conductive elements. A heat dissipation member covers part of the routing structure's surface, while an electronic module is placed on another part. This configuration ensures that heat energy from both the electronic module and the package module is effectively dissipated through the heat dissipation pad and member.

Career Highlights

Chiu-Ling Chen is currently employed at Siliconware Precision Industries, Ltd., a leading company in the semiconductor packaging industry. His work has been instrumental in advancing the technology used in electronic packaging, making devices more efficient and reliable.

Collaborations

Chiu-Ling Chen has collaborated with notable coworkers, including Lung-Yuan Wang and Hsin-Jou Lin. Their combined expertise has contributed to the successful development of innovative electronic packaging solutions.

Conclusion

Chiu-Ling Chen's contributions to electronic packaging through his patents demonstrate his commitment to innovation in the field. His work not only enhances the performance of electronic devices but also sets a standard for future developments in the industry.