The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
May. 02, 2023
Siliconware Precision Industries Co., Ltd., Taichung City, TW;
Yen-Yu Chu, Taichung City, TW;
Tsung-Yu Huang, Taichung City, TW;
Kuo-Hua Tseng, Taichung City, TW;
Tsung-Xin Chien, Taichung City, TW;
Chang-Ku-Yuan Sie, Taichung City, TW;
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung City, TW;
Abstract
An electronic package is provided, in which an electronic component and conductors are disposed on a substrate structure, and the electronic component and the conductors are covered by an encapsulation layer. A conductive layer is formed on side surfaces of the encapsulation layer and in contact with the conductors, where the conductors are bonding wires used in a wire bonding process. Therefore, a conventional heat sink is replaced by the conductors, thereby reducing a use area of the substrate structure.