Chang-Ku-Yuan Sie

Title: Chang-Ku-Yuan Sie: Electronic Packaging Inventor

Introduction

Chang-Ku-Yuan Sie is an inventor associated with Taichung, Taiwan, and Siliconware Precision Industries, Ltd. His patent work addresses electronic packaging and the efficient use of substrate space.

Latest Patents

Sie is named on one patent, 1 patent: “Electronic Package and Manufacturing Method Thereof.” The invention describes an electronic component and conductors arranged on a substrate structure and covered by an encapsulation layer. A conductive layer is formed along the encapsulation layer’s side surfaces and contacts the conductors, which are bonding wires used in a wire-bonding process. By using the conductors in place of a conventional heat sink, the design can reduce the area occupied on the substrate structure.

Career Highlights

Sie’s listed patent reflects work in electronic packaging, including approaches to integrating conductive elements with encapsulated components. He is associated with Siliconware Precision Industries, Ltd.

Collaborations

Yen-Yu Chu and Tsung-Yu Huang are identified as Sie’s coworkers. Their names are provided as professional associations, though the available information does not specify their roles in the patent.

Conclusion

Chang-Ku-Yuan Sie’s patent presents an electronic packaging design that uses bonding-wire conductors and a side-surface conductive layer to reduce substrate area.