This inventor holds 1 USPTO granted patent. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yen-Yu Chu: Inventor in Electronic Packaging
Introduction
Yen-Yu Chu is an inventor associated with Taichung, Taiwan, and Siliconware Precision Industries, Ltd. The supplied information identifies one patent associated with Chu.
Latest Patents
Chu’s patent, “Electronic Package and Manufacturing Method Thereof,” describes an electronic package with an electronic component and conductors arranged on a substrate structure and covered by an encapsulation layer. A conductive layer is formed along the encapsulation layer’s side surfaces and contacts the conductors, which are bonding wires. The design uses the conductors in place of a conventional heat sink, reducing the area required on the substrate structure. Chu is credited with 1 patent in the information provided.
Career Highlights
Chu’s listed company affiliation is Siliconware Precision Industries, Ltd. The patent focuses on electronic packaging and a manufacturing approach intended to use substrate space more efficiently.
Collaborations
The supplied information lists Tsung-Yu Huang and Kuo-Hua Tseng as Chu’s coworkers. It does not specify whether they collaborated on the patent.
Conclusion
Yen-Yu Chu’s listed invention addresses electronic package design by using bonding-wire conductors to support a compact structure and reduce substrate area.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile