This inventor holds 4 USPTO granted patents and 4 published patent applications. Top assignees: Siliconware Precision Industries Co., Ltd., Siliconware Precision Industries, Ltd.. Active years: 2016-2026.
Location History:
- Taichung, TW (2016)
- Taichung Hsien, TW (2016)
Company Filing History:
2 out of 826 
2 out of 30 Years Active: 2016-2026
Title: Hsiu-Jung Li: Innovator in Package Structure Technology
Introduction
Hsiu-Jung Li is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of package structure technology, holding a total of 4 patents. His work focuses on innovative methods for fabricating package structures that enhance electronic device performance.
Latest Patents
Hsiu-Jung Li's latest patents include a "Method for Fabricating Package Structure" and "Package Structure and Fabrication Method Thereof." Both patents describe a package structure that consists of a substrate with conductive pads, a surface passivation layer, and conductive vias. These inventions aim to improve the bonding between circuits and passivation layers, thereby enhancing the reliability and efficiency of electronic devices.
Career Highlights
Hsiu-Jung Li is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has allowed him to develop and refine his innovative ideas in package structure technology. His contributions have been instrumental in advancing the capabilities of electronic packaging.
Collaborations
Hsiu-Jung Li has collaborated with talented coworkers, including Chun-Wei Yeh and Ya-Yi Lai. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Hsiu-Jung Li is a prominent inventor whose work in package structure technology has made a significant impact in the electronics industry. His patents reflect his commitment to innovation and excellence in engineering.