The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2016
Filed:
Aug. 20, 2013
Chun-wei Yeh, Tantzu, TW;
Chun-hsien Shen, Taichung Hsien, TW;
Hsiu-jung LI, Taichung Hsien, TW;
Ya-yi Lai, Taichung Hsien, TW;
Fu-tang Huang, Taichung, TW;
Chun-Wei Yeh, Tantzu, TW;
Chun-Hsien Shen, Taichung Hsien, TW;
Hsiu-Jung Li, Taichung Hsien, TW;
Ya-Yi Lai, Taichung Hsien, TW;
Fu-Tang Huang, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A package structure is disclosed, which includes a substrate having a body, a plurality of conductive pads formed on the body and a surface passivation layer formed on the body and having a plurality of openings for exposing the conductive pads; a plurality of conductive vias formed in the openings of the surface passivation layer and electrically connected to the conductive pads; a plurality of circuits formed on the surface passivation layer and electrically connected to the conductive vias, wherein the circuits have a plurality of electrical contacts; at least a pattern portion formed on the surface passivation layer and intersecting with the circuits; and a second passivation layer formed on the surface passivation layer, the circuits and the pattern portion and having a plurality of openings for exposing portions of the electrical contacts of the circuits, thereby strengthening the bonding between the circuits and the passivation layers.