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For the Inventor, By the Inventor

Taichung, Taiwan

Fu-Tang Huang

This inventor holds 22 USPTO granted patents and 9 published patent applications, primarily in Semiconductor Packaging. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2016-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fu-Tang Huang. Retrieved from https://idiyas.com/inventor/fu-tang-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22 

% Patents Active = 100.0

Average Co-Inventor Count = 4.4

ph-index = 4

Forward Citations = 45(Granted Patents)


Company Filing History:

goldMedal22 out of 826 
 
Siliconware Precision Industries Co., Ltd.
 patents

Years Active: 2016-2024

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Areas of Expertise:
Semiconductor Packaging
Fabrication Method
Electronic Package
Substrate Structure
Package Stack
Embedded Package
Concave Portion
Device Structure
Manufacturing Process
Stack Structure
Filling Material
Semiconductor Device
22 patents (USPTO):Explore Patents
1. 11973014 - Method of manufacturing substrate structure with filling material formed in concave portion (2024-04-30),
2. 11516925 - Package stack structure and method for manufacturing the same (2022-11-29),
3. 11205644 - Method for fabricating electronic package (2021-12-21),
4. 10872870 - Fabrication method of semiconductor structure (2020-12-22),
5. 10629572 - Electronic package and method for fabricating the same (2020-04-21),
6. 10522453 - Substrate structure with filling material formed in concave portion (2019-12-31),
7. 10510720 - Electronic package and method for fabricating the same (2019-12-17),
8. 10361150 - Substrate construction and electronic package including the same (2019-07-23),
9. 10325872 - Fabrication method of semiconductor structure (2019-06-18),
10. 10199331 - Fabrication method of electronic package having embedded package block (2019-02-05),
11. 10192834 - Semiconductor package and fabrication method thereof (2019-01-29),
12. 9907186 - Electronic package structure and method for fabricating the same (2018-02-27),
13. 9900996 - Package substrate and structure (2018-02-20),
14. 9842771 - Semiconductor device and fabrication method thereof and semiconductor structure (2017-12-12),
15. 9812340 - Method of fabricating semiconductor package having semiconductor element (2017-11-07),

Title: Fu-Tang Huang: Pioneering Inventor from Taichung

Introduction: Fu-Tang Huang is a renowned inventor hailing from Taichung, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Fu-Tang Huang holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to creating solutions for the future.

Career Highlights: With a career spanning over two decades, Fu-Tang Huang has worked with leading tech companies and research institutions, spearheading projects that have revolutionized industries worldwide.

Collaborations: Throughout his career, Fu-Tang Huang has collaborated with top scientists, engineers, and visionaries, fostering a culture of innovation and excellence in all his endeavors.

Conclusion: Fu-Tang Huang's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and entrepreneurs globally.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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