The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2019
Filed:
May. 09, 2017
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Chee-Key Chung, Taichung, TW;
Yu-Min Lo, Taichung, TW;
Han-Hung Chen, Taichung, TW;
Chang-Fu Lin, Taichung, TW;
Fu-Tang Huang, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
The disclosure provides a substrate construction applicable to a 3D package, including a silicon substrate for carrying a chip on an upper side thereof, and a circuit structure formed underneath the silicon substrate for being connected to solder balls via conductive pads of the circuit structure, thereby obtaining the same specification of the conductive pads as ball-planting pads of conventional package substrates and avoiding the manufacturing and use of conventional package substrates.