The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2018
Filed:
May. 30, 2017
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Chih-Hsien Chiu, Taichung, TW;
Chen-Wen Huang, Taichung, TW;
Hsin-Lung Chung, Taichung, TW;
Wen-Jung Tsai, Taichung, TW;
Jia-Huei Hung, Taichung, TW;
Fu-Tang Huang, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
An electronic package structure is provided, which includes: a carrier; at least one electronic component and a plurality of conductive elements disposed on the carrier; a metal frame bonded to the conductive elements; and an encapsulant formed on the carrier and the metal frame and encapsulating the electronic component and the conductive elements. The metal frame is exposed from the encapsulant to serve as an electrical contact. As such, instead of using a mold having a particular size corresponding to the electronic package structure as in the prior art, the present disclosure can use a common mold to form the encapsulant, thereby reducing the fabrication cost. The present disclosure further provides a method for fabricating the electronic package structure.