The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 21, 2021
Filed:
Mar. 12, 2020
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Chi-Rui Wu, Taichung, TW;
Fu-Tang Huang, Taichung, TW;
Chia-Cheng Chen, Taichung, TW;
Chun-Hsien Lin, Taichung, TW;
Hsuan-Hao Mi, Taichung, TW;
Yu-Cheng Pai, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
An electronic package is provided, including: a first substrate having a first insulating portion; a first electronic component disposed on the first substrate; a second substrate having a second insulating portion and stacked on the first substrate through a plurality of conductive elements; and a first encapsulant formed between the first substrate and the second substrate. The first insulating portion of the first substrate differs in rigidity from the second insulating portion of the second substrate. As such, during a high temperature process, one of the first substrate and the second substrate pulls at the other to bend toward the same direction, thereby reducing warpage deviation of the overall electronic package. The present invention further provides a method for fabricating the electronic package.