This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2020-2021.
Company Filing History:
Years Active: 2020-2021
Title: Hsuan-Hao Mi: Innovator in Electronic Packaging
Introduction
Hsuan-Hao Mi is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 2 patents. His work focuses on improving the reliability and performance of electronic components through innovative packaging methods.
Latest Patents
Hsuan-Hao Mi's latest patents include a method for fabricating an electronic package. This electronic package consists of a first substrate with a first insulating portion, a first electronic component placed on the first substrate, and a second substrate with a second insulating portion stacked on the first substrate via multiple conductive elements. A first encapsulant is formed between the two substrates. The unique aspect of this invention is that the rigidity of the first insulating portion differs from that of the second insulating portion. This design allows one substrate to pull at the other during high-temperature processes, bending in the same direction and reducing warpage deviation in the overall electronic package. The invention also provides a method for fabricating this electronic package.
Career Highlights
Hsuan-Hao Mi is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has been instrumental in advancing electronic packaging technologies. His innovative approaches have garnered attention in the industry, contributing to the development of more efficient electronic devices.
Collaborations
Hsuan-Hao Mi has collaborated with several talented individuals in his field, including Chun-Hsien Lin and Fu-Tang Huang. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.
Conclusion
Hsuan-Hao Mi's contributions to electronic packaging through his patents and collaborations highlight his role as an innovator in the field. His work continues to influence the design and manufacturing of electronic components, ensuring greater reliability and performance in modern technology.