Chun-Wei Yeh

Title: Innovations of Chun-Wei Yeh

Introduction

Chun-Wei Yeh is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of package structures, holding a total of 2 patents. His work focuses on enhancing the efficiency and reliability of electronic packaging.

Latest Patents

Chun-Wei Yeh's latest patents include a method for fabricating a package structure. This innovative package structure features a substrate with a body, multiple conductive pads, and a surface passivation layer with openings to expose the conductive pads. Additionally, it incorporates conductive vias that connect electrically to the conductive pads and circuits formed on the surface passivation layer. These circuits have several electrical contacts and are designed to strengthen the bonding between the circuits and the passivation layers. Another patent he holds is for a similar package structure and fabrication method, emphasizing the importance of reliable connections in electronic devices.

Career Highlights

Chun-Wei Yeh is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has allowed him to develop and refine his innovative ideas in electronic packaging. His contributions have been instrumental in advancing the technology used in the industry.

Collaborations

Chun-Wei Yeh has collaborated with several talented individuals, including Chun-Hsien Shen and Hsiu-Jung Li. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Chun-Wei Yeh's contributions to the field of electronic packaging through his patents and collaborations highlight his role as a significant inventor. His work continues to influence advancements in technology, making him a key figure in the industry.