The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Jul. 24, 2023
Siliconware Precision Industries Co., Ltd., Taichung City, TW;
Pin-Jing Su, Taichung City, TW;
Wen-Yu Teng, Taichung City, TW;
Liang-Yi Hung, Taichung City, TW;
Chia-Cheng Chen, Taichung City, TW;
Yu-PO Wang, Taichung City, TW;
SILICONWARE PRECISION INDUSTRIES CO., LTD., Taichung City, TW;
Abstract
An electronic package and a substrate structure thereof are provided, in which an electronic element and a flow stopper surrounding the electronic element are disposed on a substrate body of the substrate structure, and a heat dissipation structure is bonded on the electronic element via a heat dissipation material, so that the flow stopper limits an overflow range of the heat dissipation material to prevent the heat dissipation material from contaminating a circuit layer on the substrate body.