Taichung City, Taiwan

Pin-Jing Su

This inventor holds 2 USPTO granted patents. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Pin-Jing Su. Retrieved from https://idiyas.com/inventor/pin-jing-su-4bffto4c

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Pin-Jing Su

Introduction

Pin-Jing Su is a notable inventor based in Taichung City, Taiwan. He has made significant contributions to the field of electronic packaging, holding a total of 2 patents. His work focuses on improving heat dissipation methods in electronic devices, which is crucial for enhancing their performance and longevity.

Latest Patents

Pin-Jing Su's latest patents include innovative designs that address heat management in electronic packages. The first patent, titled "Electronic package with improved heat dissipating and manufacturing method thereof," describes an electronic package where an electronic element is placed on a carrier structure. A heat conduction layer is formed on the electronic element, and a heat dissipation member with a recess portion is positioned on the heat conduction layer. This design allows for better heat flow management, facilitating the formation of a robust intermetallic structure between the heat dissipation member and the electronic element, thereby enhancing the heat dissipation effect.

The second patent, "Electronic package and substrate structure thereof," presents a substrate structure that includes an electronic element surrounded by a flow stopper. This flow stopper is designed to limit the overflow of heat dissipation material, preventing contamination of the circuit layer on the substrate body. This innovative approach ensures that the heat dissipation material remains effective without compromising the integrity of the electronic device.

Career Highlights

Pin-Jing Su is currently employed at Siliconware Precision Industries, Ltd., a leading company in the semiconductor packaging industry. His work at this company has allowed him to apply his innovative ideas in practical applications, contributing to advancements in electronic packaging technology.

Collaborations

Throughout his career, Pin-Jing Su has collaborated with talented individuals such as Wen-Yu Teng and Liang-Yi Hung. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies in the field of electronics.

Conclusion

Pin-Jing Su's contributions to electronic packaging through his innovative patents demonstrate his commitment to advancing technology in this field. His work not only enhances the performance of electronic devices but also sets a foundation for future innovations in heat management solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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