This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Wen-Yu Teng: An Inventor in Electronic Packaging
Introduction
Wen-Yu Teng is an inventor associated with Taichung City, Taiwan. Her work includes an invention focused on electronic packaging and substrate design.
Latest Patents
Teng is credited with 1 patent, titled “Electronic Package and Substrate Structure Thereof.” The invention describes an electronic element and a surrounding flow stopper placed on a substrate body. A heat dissipation structure is bonded to the electronic element using heat dissipation material. The flow stopper helps limit the material’s overflow, reducing the risk of contamination to a circuit layer on the substrate body.
Career Highlights
Teng is associated with Siliconware Precision Industries, Ltd. Her patent addresses a practical challenge in electronic package assembly by helping control the placement of heat dissipation material.
Collaborations
Teng’s listed coworkers include Pin-Jing Su and Liang-Yi Hung.
Conclusion
Wen-Yu Teng’s patent reflects an engineering contribution to electronic packaging, with a design intended to protect substrate circuitry while supporting heat dissipation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile