This inventor holds 1 USPTO granted patent and 8 published patent applications. Top assignee: Siliconware Precision Industries, Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Chia-Cheng Chen: Innovator in Electronic Packaging
Introduction
Chia-Cheng Chen is an inventor based in Taichung City, Taiwan. He is known for his contributions to the field of electronic packaging. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.
Latest Patent Applications
Chia-Cheng Chen has filed several notable patent applications, including one for an electronic package and manufacturing method. This electronic package features a carrier structure, an electronic component bonded to the carrier, a heat conduction component, a substrate, and encapsulating material. The design aims to prevent encapsulant overflow, which can lead to poor heat dissipation and electrical contact failures, thereby enhancing the reliability of the electronic package. Another application focuses on an electronic package that includes a carrier structure and a packaging module connected by conductive members. This design ensures that stresses exerted on the conductive members do not directly affect the conductive vias, thus improving the overall reliability of the electronic package.
Conclusion
Chia-Cheng Chen's innovative approaches in electronic packaging demonstrate his commitment to enhancing the reliability and efficiency of electronic components. His latest patent applications reflect a forward-thinking mindset that could significantly impact the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile