Taichung, Taiwan

Yih-Jenn Jiang

USPTO Granted Patents = 10 

Average Co-Inventor Count = 4.1

ph-index = 3

Forward Citations = 29(Granted Patents)


Company Filing History:


Years Active: 2009-2025

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10 patents (USPTO):Explore Patents

Title: Yih-Jenn Jiang: Innovator in Electronic Packaging Technology

Introduction

Yih-Jenn Jiang is an accomplished inventor based in Taichung, Taiwan. With a remarkable portfolio of 8 patents, Jiang has significantly contributed to the field of electronic packaging technology, making strides in manufacturing techniques and circuit design.

Latest Patents

Jiang's latest innovations include two notable patents related to electronic packages and their manufacturing methods. The first patent introduces a sophisticated electronic package that involves forming a plurality of conductive pillars. An electronic element is positioned on a first circuit structure, which is then covered by a cladding layer. This design allows for electrical connections between the first and second circuit structures while integrating a fan-out redistribution layer and ground layers designed with an array of sheet bodies.

The second patent focuses on an innovative electronic package that features a circuit layer and a metal layer with multiple openings on a dielectric layer. This design enables a reduced area ratio between the metal and dielectric layers, mitigating stress concentration and preventing warping of the electronic package.

Career Highlights

Yih-Jenn Jiang is currently employed at Siliconware Precision Industries Co., Ltd. His expertise in electronic packaging has positioned him as a leader in the industry, where he continuously explores new ways to enhance manufacturing processes and product reliability.

Collaborations

Throughout his career, Jiang has collaborated with notable colleagues such as Han-Ping Pu and Chien-Ping Huang. These partnerships have not only enriched his work but have also contributed to the innovation landscape in electronic packaging.

Conclusion

Yih-Jenn Jiang is a distinguished inventor whose contributions to electronic packaging technology exemplify the spirit of innovation. Through his patents and collaborative efforts, he continues to push the boundaries of what is possible in the realm of electronics, ensuring advancements that benefit both the industry and consumers alike.

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